• No harmful crystal defects in the surface and bulk
• Comparable performance with Epi, at lower cost
• Better performance than annealed wafers at comparable cost
• Deep precipitate-free zone maintained throughout customer processing
• Robust IG protection through MDZ®
• Insurance against device yield upsets caused by metallic contamination * Built-in IG template through MDZ® eliminates need for customer oxygen out-diffusion and nucleation

Benefits

• No crystal defect related yields and reliability degradation
• Cost-effective starting material wafers, at lower cost alternative compared to other advanced wafers
• Superior-performance alternative to annealed wafers
• Improved device yield and reliability potential by eliminating all oxygen precipitates in device layer
• Insurance against device yield upsets caused by metallic contamination
• Improved customer cost of ownership through cycle time reduction