• A silicon solution that will deliver yield and device performance also on advanced device processes.

• An easy to specify product that will perform well across your entire range of device technologies.

• The opportunity to improve your total cost of ownership through elimination of furnace steps early in the fab process, when combined with MDZ®.

• Lower price and lower Cost of Ownership than competitive wafers.

Features	Benefits
Reduced COPS -> High GOI	Decreased possibility of yield and reliability degradation due to crystal-related defects
Cost-effective manufacturing process	Cost-effective starting material alternative compared to other advanced wafers
Comparable performance with annealed wafers at much better cost	Lower customer cost of ownership than annealed wafers
Deep precipitate-free zone maintained throughout customer processing	Improved device yield and reliability potential by eliminating all oxygen precipitates in device layer
Robust IG protection through MDZ®	Insurance against device yield upsets caused by metallic contamination
Build-in IG template through MDZ® eliminates the need for customer oxygen out-diffusion and nucleation	Improved customer cost of ownership through cycle time reduction