Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication of today's advanced semiconductor devices. It is an automated, multi-step process using ultra-fine slurry and pressure against two rotating surfaces (similar to lapping). This is accomplished using our proprietary, ninth-generation polishing machines with an innovative, chemical-mechanical polishing process pioneered by MEMC in the 1960's. This form of polishing allowed solid state devices to move from individual circuits to the complexities of today's integrated circuits. Forty years later, it remains the industry standard for polishing silicon wafers.