MEMC Firsts

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1959	MEMC was the first merchant manufacturer of silicon wafers. First silicon wafer in mass production: 19mm.
1962	MEMC was the first to develop chemical-mechanical polishing for the semiconductor industry.
1966	MEMC discovers readily observable faceted growth lines are real-time indicators of dislocation free crystal in Czochralski Si growth.
1975	First to commercially produce 100mm wafers.
1979	First wafer supplier to control oxygen.
1979	First to commercially produce 125mm wafers.
1981	First to commercially produce 150mm wafers.
1982	MEMC pioneered epi wafers for CMOS applications.
1983	First ozonated DI water for wafer cleaning.
1983	First non-Japanese Silicon Manufacturer to build in Japan.
1984	MEMC was the first to commercialize 200mm wafers in partnership with IBM.
1985	First to develop polysilicon gettering.
1991	MEMC begins commercial production of 300mm wafers.
1991	MEMC developed the first process using granular polysilicon.
1995	MEMC trades on the New York Stock Exchange as an Initial Public Offering (IPO) under the stock symbol "WFR."
1999	MEMC developed MDZ®, a breakthrough thermal processing technique, in the mid 90's and was granted the first patent on this technology in 1999. MEMC developed the first defect-free silicon wafer and was granted the first patent on this technology in 1999. This is now marketed as the OPTIAª product line.
1999	Perfect SiliconTM brand wafers are yet another breakthrough in silicon technology by eliminating crystal defects at the wafer surface and throughout the wafer bulk.
2001	Texas Pacific Group purchases MEMC from E.ON AG.
2005	TPG Wafer Holdings LLC, completes the sale(s) of 85,000,000 shares of common stock. TPG's beneficial ownership of the company's common stock is reduced from 63% to approximately 25%.
2005	MEMC becomes the world's first company to produce 300mm wafers in Taiwan.