On August 30, 2005, MEMC celebrated the start of 300mm wafer production at its Taisil facility in Hsinshu, Taiwan with a traditional "Ribbon Cutting" ceremony. MEMC now becomes the first producer of 300mm wafers in Taiwan.

Participating in the event are from left to right: Charles Kau (President, Inotera), Brian Hsieh (President, Powerchip), Len Mei (SVP, ProMOS), Steve Tso (SVP, TSMC), Roger Chen (President, Taisil), Nabeel Gareeb (CEO, MEMC), Sean Hunkler (SVP, MEMC), YK Cheng (Hsinchu County Mayor), JT Lin (Hsinchi City Mayor), Mr. Tung (Deputy Director General of Hsinchu Science Park), HJ Wu (President, UMC), Paul Chien (Chairman, Vanguard) and Wilson Wen (VP, Winbond)

Traditional Chinese "Lucky Lion" Dance

Nabeel Gareeb, Chief Executive Officer, MEMC

Enter your recipient's email address and click the button to email page: